| Abstract | Miniaturization technology based on Dennard's rule for LSI has been
technically progressing throughout the years and it has conferred a
benefit on human's life. Optical lithography has an amazing progress
so far with achieving high resolution at 90nm or less using various
kinds of technologies. However, there is a low probability that this
scenario of producing ever-finer feature geometry will continue,
because resolution capabilities will soon reach a critical limit due
to CMOS performance threshold and chip economy. Therefore, to assure
continued performance improvements for the future of LSI devices, next
generation interconnect and advanced packaging technologies should
acquire importance. Especially, a new 3 dimensional (3D) monolithic
integration would be an integral part of this technology. At the same
time, the definition of the semiconductor device should be updated
into "System&Design Integration (SDI)." SDI will provide the needed
feedback to launch a new field of clear applications based on a total
system solution with innovated equipments of design, fabrication,
inspection and evaluation. 3D-LSI and SDI will have a tremendous
impact on the future electronics industries. |